Atlas Research Note

High-NA EUV Gains a Broader Production Roadmap

Ben Bajarin · September 8, 2026

TSMC's commitment to begin High-NA EUV production in 2030 gives suppliers a firmer basis for planning around the technology. Alongside Samsung's 2028 DRAM target and Intel's current use on selected production layers, it strengthens our view that High-NA will find applications across advanced logic and memory. ASML has the clearest direct exposure to that expansion, although the amount of equipment customers buy will depend on how many layers move to High-NA and how much work each tool can perform.

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Notes

High-NA EUV Gains a Broader Production Roadmap

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