Atlas Research Note

Micron's AI Memory Roadmap: Bandwidth Moves Onto the Compute Die, and Wafers Stay Tight

Ben Bajarin · October 21, 2026

Creative Strategies Atlas note | October 21, 2026 | Micron's AI Memory and Storage Roadmap technology webinar with Scott DeBoer, President and Chief Technology and Products Officer, plus our follow-up conversation with Scott after the event Operating view: Each new AI memory product on Micron's roadmap takes more wafers per bit than the one before it. HBM5, vertical HBM (vHBM) and vertical edge inference memory (vEIM) all target volume in 2028, and Scott told us trade ratios rise at each step. Our Core Memory model already has HBM supply-limited from 2029, and it does not yet carry vHBM or vEIM, so our current theory is that the risk to our supply balance skews tighter.

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Micron's AI Memory Roadmap: Bandwidth Moves Onto the Compute Die, and Wafers Stay Tight

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